TECHNICAL DATA
HPA Polish 2
BD0092

HPA Polish is an aluminum oxide slurry designed for use on various plastic substrates.  HPA Polish has been designed for easy cleanability with foam suppression.  

Application

Use HPA Polish solution as is. For best results, please consult with UPI technical staff to recommend optimal processing conditions.

Benefits
  • Fast removal rates
  • Easy clean up
  • Long life
Physical Characteristics
Test HPA Polish 2
pH 2.5 - 3.6
Baume (°) 23 - 28
Particle Size (µm) 2
Availability
  • 1 Gallon(s)
Information included herein was obtained from sources which UNIVERSAL PHOTONICS, INC. and its subsidiaries believes are reliable and accurate as of the date hereof. However, no representations or warranties, either expressed or implied, of merchantability, fitness for a particular purpose or of any other nature are made herein as to the information provided or the product to which the information refers. The health and safety precautions contained herein may not be adequate for all individuals and/or situations. It is the user's obligation to evaluate and use this product safely and to comply with all applicable laws and regulations. Given the variety of factors that can affect the use and application of a product, some of which are uniquely within the user's knowledge and control, it is essential that the user evaluate the product to determine whether it is fit for a particular purpose and suitable for user's method of use or application. We assume no legal liability for any injury, accident, loss, or damage through the use of this product. ver.06.05.2024/TD