TECHNICAL DATA
LP-57
LP-57

The LP-57 is an unfilled, small pore size polyurethane pad.
It is designed for silicon wafer primary polishing but has proven suitable for general polishing applications at moderate or higher pressures.

Application

Semiconductor wafers, primary polishing, Sapphire, final polishing, Precision Optics,
Quartz, Glass, primary & single step polishing, Metals, single step polishing,
CMP-Titanium, Alumina

Benefits

Short break-in period

Physical Characteristics
Test LP-57
Density [g/cm³ (lb/ft³)] 0.70 (44.0)
Hardness (Shore D) 46
Compressibility (%) 7.5
Elastic Rebound (%) 93
Information included herein was obtained from sources which UNIVERSAL PHOTONICS, INC. and its subsidiaries believes are reliable and accurate as of the date hereof. However, no representations or warranties, either expressed or implied, of merchantability, fitness for a particular purpose or of any other nature are made herein as to the information provided or the product to which the information refers. The health and safety precautions contained herein may not be adequate for all individuals and/or situations. It is the user's obligation to evaluate and use this product safely and to comply with all applicable laws and regulations. Given the variety of factors that can affect the use and application of a product, some of which are uniquely within the user's knowledge and control, it is essential that the user evaluate the product to determine whether it is fit for a particular purpose and suitable for user's method of use or application. We assume no legal liability for any injury, accident, loss, or damage through the use of this product. ver.10.24.2024a/TD