Description

#300 WAFER WAX is a heavy-duty mounting and blocking media for machining, polishing, and dicing, suitable for affixing flat surfaces of work pieces directly to machinable mounts. It has excellent holding power, machines clearly, and will not load or gum up thin cutting blades and wire. #300 WAFER WAX is widely used to mount silicon wafers for dicing, scribing, ultrasonic grinding, back lapping, and polishing. It is used to hold electronic and optical materials where a flat face is to be bonded to the mount.

Application

Depending on application, #300 WAFER WAX can be applied in two basic methods:

1. Pre-melt #300 WAFER WAX in a controlled heating vessel, and apply or pour molten wax to blocking plate or lap, and then mount the workpiece.
2. Pre-heat the blocking plate or lap and work piece, and wipe the wax across the heated tool and mount the workpiece.

To remove the wafers or finished work pieces from the mount, soak in hot water or a solvent (like acetone, methyl ethyl ketone, or Uniclear) at room temperature for about 10 minutes. Finally, rinse the wafers in a mild solution of ammonium hydroxide and rinse with deionized water. For best results, please consult with UPI technical staff to recommend optimal processing conditions.

Benefits

• Able to mount delicate pieces for various process steps

Physical Characteristics

• Appearance: Clear to Pale Amber Solid
• Flow Point (°F/°C): 163 / 73
• Softening Point (°F): 71 - 77
• Viscosity (cP at 120°C): 6000

Availability