Description

HPA Polish is an aluminum oxide slurry designed for use on various plastic substrates.  HPA Polish has been designed for easy cleanability with foam suppression.  

Application

Use HPA Polish solution as is. For best results, please consult with UPI technical staff to recommend optimal processing conditions.

Benefits

• Fast removal rates
• Easy clean up
• Long life

Physical Characteristics

• pH: 2.5 - 3.6
• Baume (°): 23 - 28
• Particle Size (µm): 2

Availability