SP-66C
SP-66C

Description

SP-66C is filled, soft polyurethane pad for double-sided sapphire polishing applications.

Application

Flat substrate

Benefits

  • High removal rate on A-plane sapphire
  • Superior surface roughness, NO scratching
  • Excellent flatness & roll-off characteristics
  • Effective with most alumina & colloidal silica slurries

Physical Characteristics

  • Filler: Proprietary
  • Density [g/cm³ (lb/ft³)]: 0.45 (28.2)
  • Hardness (Shore D): 36
  • Compressibility (%): 10.0
  • Elastic Rebound (%): 75

Documents

Document Type Langauage
Technical Data Sheet English (US)
Brochure English (US)