PLP-55 Pitch
PG5055

Description

PLP Polishing Pitch is a uniquely engineered polishing pitch designed for a broad variety of continuous polishing operations. PLP Polishing Pitch was designed by baselining conventional polishing pitch materials and applying the latest in bituminous product research & development to arrive at a revolutionary formulation. Extensive testing has shown that PLP Polishing Pitch offers superior physical parameter control, including melting point, hardness & flow characteristics.

Application

Melt the PLP Polishing Pitch in an appropriate melting vessel (UPI offers several melting pots for this purpose), & pour the melted pitch onto a properly prepared polishing lap/plate. The preparation of the polishing plate/lap & the conditioning of the poured pitch are sensitive parameters. To achieve optimal results, UPI strongly recommends that our field engineers provide guidance on the proper use & application of PLP Polishing Pitch. PLP Pitch can be removed from the parts by using Uniclear or Uniclear II.

Benefits

  • Broad range of applications
  • Maintains high degree of figure consistency
  • Holds shape over extended polishing cycle times
  • Yields angstrom-level surface finishes

Physical Characteristics

  • Ball Penetration Test (70F, 0 g weight, 1hr) (in): 0.144 - 0.176
  • Softening Point (°C): 52 - 55
  • Melting Point (°C): 67 - 71

Availability

  • 1 kg Tube

Documents

Document Type Langauage
Technical Data Sheet English (US)