Description

UNIBOND is a low melting thermoplastic designed to be hard but not brittle. UNIBOND allows for easy rapid debonding in hot water with simple cleanup.

Application

Heat the blocking plate, or lap, and the work piece. Apply heated UNIBOND by wiping across the heated blocking tool. Alternatively, melted Unibond can be poured. Allow to cool for 30 min- utes – 1 hour. UNIBOND can be removed from the parts by submerging in hot water >85°C and using mechanical or ultrasonic agitation. For rapid removal and to achieve ultra-clean surfaces, it is recommended to use a hot diluted solution of Uniclean 9.0. For best results, please consult with UPI technical staff to recommend optimal processing conditions.

Benefits

• Environmentally friendly, safer than the alternative materials
• Rigid bonding
• Superior adhesion strength
• Works well with cold or cool aqueous cutting lubricants and coolants
• Highly machinable, will not gum up diamond tooling

Physical Characteristics

• Color: Purple
• Softening Point (°C): 51 - 59
• Melting Point (°C): 55 - 63
• Ball Penetration Test (70F, 500 g weight, 1hr) (in): < 0.006
• Application: Lapping, back grinding, wafer bonding & thinning

Availability

Additional Product IDs

KD00021, KD0002