CPC-026 (CPC-026)
CPC-026 is an unfilled, small pore size polyurethane pad designed specifically for soft compound semiconductor and electro-optic material polishing.
ESM-013 (ESM-013)
ESM-013 is an unfilled semiconductor polishing pad.
ESM-U (ESM-U)
ESM-U is used for polishing single crystal silicon carbide, and titanium CMP.
GR-35 (GR-35)
GR-35 is a zirconium filled polyurethane pad for polishing of glass products.
LP-13 (LP-13)
LP-13 is a glass polishing pad similar to LP-66, but with less cerium oxide abrasive filler.
LP-26 (LP-26)
LP-26 is a hard, dense zirconia filled polyurethane pad for polishing glass products.
LP-26D (LP-26D)
LP-26D is a diamond filled polishing pad for ophthalmic polishing.
LP-46 (LP-46)
LP-46 is a soft zirconia filled polyurethane pad for polishing glass products.
LP-57 (LP-57)
The LP-57 is an unfilled, small pore size polyurethane pad.
It is designed for silicon wafer primary polishing but has proven suitable for general polishing applications at moderate or higher pressures.
LP-57C (LP-57C)
The LP-57C is an unfilled, small pore size polyurethane pad. (modified version of LP-57) It is designed for silicon wafer primary polishing but has proven suitable for general polishing applications at moderate or higher pressures.
LP-66 (LP-66)
LP-66 is the most popular cerium oxide filled polyurethane pad for polishing a wide range of glass products.
LP-77 (LP-77)
LP-77, a slightly denser version of LP-66, is a filled polyurethane pad for polishing a wide range of glass products.
LP-87 (LP-87)
LP-87 is a hard, dense, unfilled polyurethane pad for aggressive polishing of hard materials.
LP-88 (LP-88)
LP-88 is a very hard, dense ceria filled primary glass polishing pad.
LP-99 (LP-99)
LP-99 is a silica filled polishing pad for use with most polishing slurries.
LP-LASER (LP-LASER)
LP-LASER contains very fine zirconia filler, is intended for final polishing of hard glasses.
LP-S (LP-S)
LP-S is a hard, ceria polishing pad diamond polishing.
M-25 (M-25)
The M-25 is an unfilled, small pore size polyurethane pad. (Modified version of LP-57)
It is designed for reduced defects during silicon wafer primary polishing.
SP-66C (SP-66C)
SP-66C is filled, soft polyurethane pad for double-sided sapphire polishing applications.